20 XFBGA, WLCSP 300MA ULTRA LOW POWER BUCK BOOST RP605Z253B-E2-F Power Management (PMIC) Manufacturer Channel
Store rating:5.0
(125 reviews)
Attributes
RP605Z253B-E2-FModel Number
Surface MountMounting Type
ChinaPlace of Origin
OriginalBrand Name
Power Management SpecializedFunctional Application
20 XFBGA, WLCSPPackaging
Series:Power Management (PMIC)
Describe:300MA ULTRA LOW POWER BUCK BOOST
Key attributes
Model Number
RP605Z253B-E2-F
Mounting Type
Surface Mount
Place of Origin
China
Brand Name
Original
Functional Application
Power Management Specialized
Packaging
20 XFBGA, WLCSP
Series
Power Management (PMIC)
Describe
300MA ULTRA LOW POWER BUCK BOOST
Packaging and delivery
Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg
Lead time
Product descriptions from the supplier
1 - 4999 pieces
$1.09
>= 5000 pieces
$0.55
Variations
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Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
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