MECHANIC IBGA-12 Magnetic Positioning Tin Planting Platform Mobile Phones Double Layer BGA Motherboard Repair Stencil for Solder
Store rating:5.0
(1 review)
Attributes
Mobile phonesapplication
NoneModel Number
Chinaplace of origin
phone repair, solder placement, de-gummingRecommended Uses For Product
Key attributes
application
Mobile phones
Model Number
None
place of origin
China
Recommended Uses For Product
phone repair, solder placement, de-gumming
Packaging and delivery
Selling Units
Single item
Single package size
11X7.5X2 cm
Single gross weight
0.050 kg
Lead time
Minimum order quantity: 1 piece
$1004
Variations
Select nowequipment&tool type: Ibga-12
Plug Type
Ibga-12
Shipping
Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
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