XWS PCB Board Assembly Multilayer ENIG Blind Burried Vias HDI PCB Manufacturer
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Attributes
4 layerNumber of Layers
1.6mmBoard Thickness
XWS-13Model Number
Multilayer pcbType
Guangdong, ChinaPlace of Origin
XWSBrand Name
Base Material:FR-4
Copper Thickness:1oz
Min. Hole Size:0.2mm
Min. Line Width:0.2mil
Min. Line Spacing:0.12mil
Surface Finishing:ENIG
Solder mask color:Blue.green.red.black.white.etc
PCB Assembly process:available
Board thickness:0.8-3.0mm
copper thickness:1 0Z /35um
Silk screen:white
E-test:100%
Inner package:Vacuum packing
Surface Finishing:ENIG
Key attributes
Number of Layers
4 layer
Board Thickness
1.6mm
Model Number
XWS-13
Type
Multilayer pcb
Place of Origin
Guangdong, China
Brand Name
XWS
Base Material
FR-4
Copper Thickness
1oz
Min. Hole Size
0.2mm
Min. Line Width
0.2mil
Min. Line Spacing
0.12mil
Surface Finishing
ENIG
Solder mask color
Blue.green.red.black.white.etc
PCB Assembly process
available
Board thickness
0.8-3.0mm
copper thickness
1 0Z /35um
Silk screen
white
E-test
100%
Inner package
Vacuum packing
Surface Finishing
ENIG
Base Material
FR-4
Packaging and delivery
Selling Units
Single item
Single package size
10X10X10 cm
Single gross weight
0.500 kg
Lead time
Product descriptions from the supplier
Warning/Disclaimer
California Proposition 65 Consumer WarningView more
10 - 999 square meters
$0.12
>= 1000 square meters
$0.10
Quantity
Shipping
Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
Item subtotal
$0.00
Shipping total
To be negotiated
Subtotal
$0.00
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